Process Engineer

Location: Houston TX

We are seeking a SMT Process Engineer to join our clients Automotive Electronic Products (AEP) team

Location: Logansport, Indiana

Major responsibilities:

  • Develop and Validate various PCB (Printed Circuit Board) assembly processes (SMT and Through-hole). Includes Component Prep, Taping, Soldering Process Development (hand, wave, and selective soldering), Supporting Documentation, Box Build Instructions and Packaging for all assemblies.
  • Develops SMT (Surface Mount Technology) re-flow and wave solder temperature profiles and make the necessary adjustments to obtain acceptable solder connections per IPC-A-610 with excellent repeatability and reproducibility of manufacturing processes.
  • Set-up new PCBA (Printed Circuit Board Assembly) product lines.
  • Develop and initiate new tooling, jigs and fixtures for all manufacturing processes.
  • Manage multiple projects and priorities in a teamwork environment while performing job functions in a timely manner.
  • Interfaces with Design Engineering to improve new product designs and manufacturability
  • Ability to program, interpret, analyze and provide corrective action for SPI/AOI/ICT and functional test.
  • Provides documentation and technical presentations as required.
  • Performs other duties as assigned or required.
  • Must be proficient in CircuitCAM, Visio, Auto-CAD (or Equiv) and Detailed Electronic Based Work Instruction Development.

Key Qualifications:

  • Must Read and Interpret Circuit Board Schematics, Module Box Assembly Drawings and Define Manufacturing steps to meet all requirements
  • Experience Generating Manufacturing Work Instructions
  • Understanding of Industry Standards for CCA, Module and box assembly requirements including IPC, J-STD
  • Familiarity with electronic manufacturing processes (SMT, PTH, Potting, Coating, X-Ray, AOI, etc.)
  • Must have time study, labor standard, routing and lean manufacturing experience
  • Non-conformance processing (i.e., defect disposition, cause and corrective action, etc.)
  • Experience Programming and operating manufacturing equipment
  • Familiarity with IFS (Quotes, Routings, Bill of Material Construction)
  • Defect Trend Analysis and Root Cause Assignable Cause and Corrective Action
  • Hands on experience with automated soldering, wiring concepts, torque, epoxy bonding, and other electronics assembly processes
  • Lean or Six Sigma experience preferred
  • New Process Introduction development and experience validating processes for advanced manufacturing applications

TRAVEL: Less than 10%